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AlN / aluminum nitride substrates
Standard / Customized / Metalized
The aluminum nitride substrate has excellent thermal, mechanical and electrical properties. With the rapid development of microelectronic devices, aluminum nitride substrates with high thermal conductivity are widely used in communication devices, high brightness LEDs, power electronic devices, and other industries.
Technical specifications
| Technical Item | Unit | Value | |
|---|---|---|---|
| Density | g/cm3 | ≥ 3,33 | |
| Surface roughness | μm | 0,02-0,04 (Polished) | 0,1-0,3 (as fired) |
| Camber | length ‰ | < 1,5 ‰ (Polished) | < 2 ‰ (as fired) |
| Thermal conductivity | W / m.k | ≥ 170 | |
| Thermal expansivity | x 10⁻⁶/°C | 4,5 | |
| Flexural strength | Mpa | ≥ 350 | |
| Dielectric constant | - | 8,9 | |
| Dielectric loss | x 10⁻⁴ | ||
| Volume resistivity | Oh.cm | ≥ 10¹⁴ |
Send us your request with 2D / 3D drawing.
We would be happy to advise you.